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IEEE International Interconnect Technology Conference 2018

Mon, June 4 - Thu, June 7, 2018 Santa Clara, California
Santa Clara Marriott 2700 Mission College Blvd Santa Clara, California 95054 United States

About IEEE International Interconnect Technology Conference 2018

IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, SANTA CLARA, JUNE 04-07, 2018

The 21st edition of IITC is sponsored by the IEEE Electron Devices Society as the premier conference for interconnect technology devoted of advanced metallization and 3D integration for ULSI IC applications.  Since its inception as the Tungsten Workshop in 1984, AMC has served as the leading conference for interconnect and contact metallization, and has remained at the leading edge of the development of tungsten, aluminum, and copper/low-K interconnects.  These two conferences will be combined again in 2018 for the third joint IITC/AMC conference, to be held June 4-7, 2018 at the Marriott Hotel in Santa Clara, California.

IEEE International Interconnect Technology Conference (IITC 2018) covers topics such as:

  • APPLICATION OF INTEREST
    • Advanced interconnect metallization with low-k dielectrics
    • Optical, wireless, and carbon-based interconnects, beyond Cu
    interconnects
    • Contacts to MOS devices: Silicide, III-V, 2D materials
    • Interconnects and BEOL elements for Memory: 3D NAND, CBRAM,
    PCRAM, ReRAM, MRAM, DRAM
    • 3D integration & packaging: WtW/CtW bonding, Interposer, Through Si
    Via, CPI
    • Novel System and Emerging Technology: Energy harvesting, braininspired
    computing
    • Novel Form Factors: Flexible electronics, wearables

TOPICS OF INTEREST
• Process integration, advanced patterning for MOL/BEOL
• Materials and Unit Processes (Dielectrics, Metals, barriers, Wet, CMP, PVD,
CVD, selective deposition)
• Reliability and Failure analysis, techniques and methods
• Advanced material/process characterization, design-technology co-optimization,
modelling

 

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